Exynos 2500 unveiled: 3nm GAA, Cortex-X925, bigger GPU and satellite messaging support
The Exynos 2500 was not ready in time for the Galaxy S25 series, but Samsung has put the finishing touches on it and made it official – just in time for the Galaxy Z Flip7, which will debut on July 9. The Exynos 2500 is fabbed on Samsung’s latest 3nm Gate All Around (GAA) node for improved power efficiency and uses new packaging – Fan-Out Wafer-Level Packaging or FOWLP. This allows for a reduced chip thickness and improved heat dissipation. The CPU is a 10-core (deca-core) design with what Samsung calls a 1+7+2 arrangement. In reality, it is 1+2+5+2 as the mid-cores are split into two...
The Exynos 2500 was not ready in time for the Galaxy S25 series, but Samsung has put the finishing touches on it and made it official – just in time for the Galaxy Z Flip7, which will debut on July 9. The Exynos 2500 is fabbed on Samsung’s latest 3nm Gate All Around (GAA) node for improved power efficiency and uses new packaging – Fan-Out Wafer-Level Packaging or FOWLP. This allows for a reduced chip thickness and improved heat dissipation. The CPU is a 10-core (deca-core) design with what Samsung calls a 1+7+2 arrangement. In reality, it is 1+2+5+2 as the mid-cores are split into two...
