Samsung makes Exynos 2500 official with some impressive specs!
At long last, Samsung has finally made the Exynos 2500 chip official. It is the company's first smartphone processor made on a 3nm process node, and it brings some impressive specifications, including a 10-core CPU and a fourth-generation Xclipse 950 GPU based on AMD's RDNA 3 architecture. The Exynos 2500 will likely debut with the […] The post Samsung makes Exynos 2500 official with some impressive specs! appeared first on SamMobile.

At long last, Samsung has finally made the Exynos 2500 chip official. It is the company's first smartphone processor made on a 3nm process node, and it brings some impressive specifications, including a 10-core CPU and a fourth-generation Xclipse 950 GPU based on AMD's RDNA 3 architecture.
The Exynos 2500 will likely debut with the Galaxy Z Flip 7 next month.
Exynos 2500 is Samsung's first 3nm smartphone chipset
Samsung has unveiled the Exynos 2500 chipset for high-end smartphones. It features a 10-core CPU with one Cortex-X5 core clocked at 3.3GHz, two Cortex-A725 cores running at 2.74GHz, five Cortex-A725 cores clicking at 2.36GHz, and two Cortex-A520 cores running at 1.8GHz. It has the company's in-house Xclipse 950 GPU made using AMD's RDNA 3 artchitecture and supports hardware-accelerated raytracing.
It supports LPDDR5X RAM and UFS 4.0 storage. The built-in ISP supports up to 320MP camera sensors and 8K 30fps video recording. It supports zero shutter lag for a 108MP camera sensor or a 64MP+32MP dual-camera setup. It can record up to 4K 120fps or 8K 30fps videos with 10-bit HDR.
The built-in GPU and DSP can drive a 4K/WQUXGA resolution screen at 120Hz, which is impressive. It has a built-in Exynos 5400 5G modem that supports up to 12.1Gbps download speeds. The chip also supports direct satellite connectivity via low-earth orbit satellites for emergency calling and texting when conventional cellular networks are not within the device range.
The Exynos 2500 also features GNSS, Wi-Fi 7, Bluetooth 5.4, NFC, and a USB 3.2 Type-C port. It has a powerful built-in NPU with 24K MAC NPU (2-GNPU+2-SNPU) and DSP for advanced on-device AI processing. Samsung says the chip uses fan-out wafer-level packaging (FOWLP) for improved power efficiency.
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